tech
March 28, 2026
Kandou AI raises $225M from SoftBank and Synopsys to solve AI's memory wall
Kandou AI, a Swiss semiconductor company that builds chip-to-chip interconnect technology, has raised $225 million in what it calls a Series A round, led by Maverick Silicon with strategic participation from SoftBank, Synopsys, Cadence Design Systems, and Alchip Technologies. The round values the company at $400 million. The label is worth pausing on: Kandou was founded in 2011 and previously raised more than $163 million across Series B and C rounds under the name Kandou Bus. The “Series A” designation reflects a rebrand and leadership change, not a fresh start.
TL;DR
- Kandou AI, formerly Kandou Bus, raised $225 million in a Series A round, valuing the company at $400 million.
- The company focuses on chip-to-chip interconnect technology using its Chord signalling method to enhance bandwidth and reduce power consumption.
- This funding round saw participation from Maverick Silicon, SoftBank, Synopsys, Cadence Design Systems, and Alchip Technologies.
- Kandou AI's strategy involves licensing its technology, similar to Arm's model, rather than manufacturing chips directly.
- The company's approach aims to leverage existing copper infrastructure for AI workloads, potentially offering a more cost-effective alternative to optical interconnects.
- The AI interconnect market is projected for substantial growth, with optical solutions currently dominating significant investments.
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