TSMC, Samsung commit to ASML’s newest chipmaking tools as AI drives demand
TSMC and Samsung will adopt ASML’s High NA EUV tools for advanced chipmaking as AI drives demand for smaller, more complex semiconductors.
TL;DR
- Samsung and TSMC, the leading chipmakers, will use ASML's High NA EUV lithography machines.
- These machines are vital for printing smaller and more intricate circuit patterns on silicon wafers.
- Samsung plans to use the technology for DRAM production starting in 2028 and to adopt it more broadly by 2030.
- TSMC expects to use the tools for advanced chips, driven by AI application demands.
- Intel is already using ASML's High NA EUV technology.
- The High NA machines can cost around $400 million each.
- Samsung and TSMC will also collaborate with ASML on advancing next-generation 12-inch photmask technology.
- Barclays views these commitments as positive, providing ASML with better planning visibility.