SK Hynix CEO says Indiana will be key memory production base by 2030, first U.S. facility now underway
At the groundbreaking ceremony for SK Hynix's first U.S. facility, CEO Kwak Noh-Jung says Indiana will be a key memory production base by 2030.
TL;DR
- SK Hynix broke ground on its first U.S. advanced packaging facility in West Lafayette, Indiana, on August 27, 2026.
- The $4 billion facility is designed for chip packaging, where memory chips will be stacked and connected.
- CEO Kwak Noh-Jung aims to make Indiana a key HBM production base in America by 2030.
- The project aims to strengthen the U.S. semiconductor supply chain and contribute to national and economic security.
- The first cleanroom is scheduled to open in October 2028.
- SK Hynix is receiving up to $458 million in federal CHIPS Act funds and up to $712 million in state incentives.
- The facility is expected to create around 1,000 direct jobs and an additional 6,000 related jobs.
- SK Hynix's total U.S. investments and assets are expected to exceed $45 billion by 2030.