Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change
Chipmaking changes could boost productivity of new ASML machines by 40 percent.
TL;DR
- Samsung Electronics and TSMC will adopt ASML's high NA EUV chipmaking machines in the next several years.
- These companies, alongside Intel, have agreed to switch from 6-inch to 12-inch photomasks.
- The change in photomask size is projected to boost the productivity of high NA EUV machines by 40 percent.
- High NA EUV technology enables the creation of smaller features for more powerful and efficient chips.
- Samsung plans to use the technology for memory chips by 2028, while TSMC aims for advanced chip manufacturing starting in 2030.
- Intel is already using high-NA EUV machines for mobile computing processors.
- SK Hynix is considering the photomask switch and aims to use high NA EUV for memory chips by 2028.
- ASML is currently blocked from exporting most of its chipmaking machines to China due to Dutch and US restrictions.
- China faces significant challenges in developing its own EUV lithography technology.